Another FUSO CHEMICAL technology inhabits a world where precision reaches one-millionth of a mm and impurities as tiny as one ten-millionth of a gram are unacceptable. This is the nanotechnology world, and FUSO's expertise here is playing a role in developing the next-generation computer.
The electronics industry has seen growing demands in the area of precision, shifting from a world of microns to a world of nanometers. FUSO's nanotechnology can be exemplified as: the technology to chop the section of a hair into several hundreds of thousand pieces and arrange individual pieces in order, or the technology to remove 1 mg of wastes from among the 200 truckloads of sands. The measure used in electronics industry has already shifted from microns into nanometers. As the IT Revolution represents, next generation of electronic equipment will be thinner, smaller, and lighter over the coming years. Driving this trend will be the production of ultra-compact semiconductor devices employing multi-layer LSIs and the production of electronic components with extremely high precision.
FUSO's involvement in this area goes back to 1987 when we began developing ultra-high purity colloidal silica. Today, we are the market leader of the main ingredients for final polishing slurry on silicone wafers. This technology is applied for chemical mechanical polishing (CMP), laying the groundwork for the fabrication of highly integrated, multi-layer core components for computer memory and CPUs.
Ultra-high-purity silica used as a filler for semiconductors is playing a role in the development of extremely compact, high-precision liquid crystal devices. Items including fruit acids are used as the main ingredients for coating fluid of hard disks, which are supplied to many of the world's leading manufacturers, thereby focusing people's attention on this key technology of the electronics industry.
